Hi.
I've been designing parts and cases for a number of years, and thought I'd turn my attention to the DE10-Nano, and make some case designs for the board to accommodate the various add-on boards and configurations that currently exist on this platform. My designs are not open source for a number of reasons which include the fact that I utilize heatset hardware that has to be mechanically installed into the plastic, and I further design my cases to the strengths of my 3D hardware.
Hope you enjoy the photos. I'm not sure if providing links is permitted, so for the time being, I'll share some photos of my recent designs.
This first photo provides active cooling through the use of a 40mm fan. The fan is buried into the lid to minimize the overall height of the case. A retaining fan cage is designed into the back of the lid, and it holds the fan in place with a couple black oxide screws threaded into heatset hardware embedded into the underside of the lid.
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This photo is of the passive cooling lid on the same case structure. Large angled vents promote cooling through the lid.
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And here is a photo of the back side. A large area of venting provides easy flow of air past the underside of the DE10. The SDcard access was very important to me, so I designed the case so I could ease the plastic around this area to provide easy access to the card without the need of any tools at all. Fingers are all that's needed to get the card out and put it back in. If you're anything like me, I'm always trying new things and need to remove the card all the time.
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The idea behind this case initially was to create a "silent" case that promoted cooling of the DE10-Nano, even during continuous operation. The vents are plentiful on the bottom of the case. The board is elevated above these vents to allow air to flow around the board leading to large air channels embedded into the long sides of the case. These channels lead to the top of the case. In the passive cooling design, large ventilation openings in the lid promote natural convection of air around the board out through the lid.
Over a 24 hour period, through my testing, I found that the internal temperature (depending on where it's measured) ranged from 32 to 44 degrees Celsius. The case itself never got beyond mildly warm. So I'm pretty pleased with the design.
The next one that I'll be designing utilizing my current structural design will be for Jim's DE-10 Super Expansion Board. The same concepts will apply, however there won't be a passive cooling case as his board has the integrated fan (which I've found to be remarkably quiet).
Thomas
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